Transceiver to be shown at the USB Developers Conference will help speed implementation of SuperSpeed USB

Texas Instruments Incorporated (TI), an active member of the SuperSpeed USB 3.0 promoters group, introduced a new 5-Gbps transceiver test chip designed to the USB 3.0 specification version 1.0. The new transceiver is capable of driving and receiving signals over 4-m USB 3.0 cables to ensure data integrity. This transceiver will be demonstrated at the USB Developers Conference in Tokyo, Japan on May 21-22, in booth #1. For more information on TI’s SuperSpeed USB technology see: www.ti.com/superspeedusb3-pr.

The new SuperSpeed USB transceiver and Synopsys’ intellectual property (IP) digital controller tested successfully at the USB-IF SuperSpeed Peripheral Interoperability Lab. “Demonstrating interoperability between Synopsys’ DesignWare SuperSpeed USB digital controller and TI’s USB transceiver gives designers confidence that the IP functions successfully in a real-world system environment,” said John Koeter, vice president of marketing for the Solutions Group at Synopsys. “Synopsys and TI are working together to help advance new technology into the market quickly, while minimizing risk and speeding time-to-market.”

Key Features

  • Integrated spread spectrum PLL
  • Supports multiple input reference frequencies: 20 MHz, 25 MHz, 30 MHz and 40 MHz
  • PIPE3 and ULPI compliant interfaces
  • Tested successfully at the USB-IF PIL
  • Programmable transmitter pre-emphasis
  • Best-in-class adaptive receiver equalizer

Key Benefits

  • Saves system cost by eliminating the need for an external spread spectrum clocking device
  • Interoperability across a wide selection of ASIC / FPGA platforms eases designs by allowing designers to work with the same USB device, regardless of the processor platform

Availability

The first in TI’s SuperSpeed USB family of devices, the TUSB1310, SuperSpeed USB transceiver, will sample in 4Q09 and volume production is expected in 1Q10. In addition, evaluation modules will be available to interface the TUSB1310 to a variety of processor and FPGA implementations.

Source: Texas Instruments Incorporated


Demonstration Shows Interoperability of Texas Instruments’ Transceiver and Synopsys’ DesignWare Digital Controller IP

Synopsys, Inc., a world leader in software and IP for semiconductor design and manufacturing, announced its DesignWare(R) SuperSpeed USB 3.0 digital controller IP has tested successfully for interoperability with Texas Instrument’s (TI) SuperSpeed USB 3.0 transceiver. The companies will demonstrate the joint solution at the upcoming SuperSpeed USB Developers Conference in Tokyo, Japan on May 20-21, 2009.

The demonstration will show real-world SuperSpeed USB data transfer of high-definition video from a PC to a device using the Synopsys DesignWare SuperSpeed USB 3.0 digital controller and TI’s SuperSpeed USB 3.0 transceiver. Demonstrating proven multi-vendor interoperability accelerates the development of USB 3.0-enabled devices and allows consumers to benefit from the faster “sync-and-go” capability between PCs and the next generation of portable electronic devices. The DesignWare SuperSpeed USB 3.0 digital controller has also been successfully tested with the TI SuperSpeed USB 3.0 transceiver in the USB Implementers Forum (USB-IF) SuperSpeed Peripheral Interoperability Lab.

“Synopsys provides a robust, high-quality SuperSpeed USB 3.0 IP solution,” said Dan Jensen, Connectivity Interface Solutions Manager at TI. “In addition to Synopsys’ long history of delivering USB-compliant IP, these elements are important to helping us lower integration risk and ensure our transceiver interoperates with new USB 3.0 products and existing USB 2.0 devices.”

“Synopsys is at the forefront of providing IP that enables leading semiconductor companies to incorporate the latest functionality into their advanced integrated circuits,” said John Koeter, Vice president of Marketing for the Solutions Group at Synopsys. “By working closely with TI we are enabling designers to take advantage of SuperSpeed USB 3.0 data rates and quickly create innovative products with less risk and improved time-to market.”

Availability

The DesignWare SuperSpeed USB 3.0 digital controller is shipping to early adopters now.

To see actual USB 3.0 data transfer in the Synopsys lab and for more information on the complete DesignWare SuperSpeed USB IP solution, including digital controllers, PHY, verification IP, virtual platform and drivers, visit http://www.synopsys.com/usb/.


Faraday Technology Corporation announced the availability of the commercial USB 3.0 physical layer (PHY) at UMC 0.13um high-speed (HS) process. This new component is based upon USB 3.0 version 1.0 specification, functionally and electrically, with the maximum speed of 5.0Gbps.

Succeeding to the successful histories on USB 2.0, Faraday’s USB 3.0 PHY is one of the earliest solutions appearing in the market. Due to the demand of higher-speed peripheral interface evoked by the widening gap between the speed limitation of USB 2.0 and increasing growth of data capacity; the application of USB 3.0 (SuperSpeed USB) will cover not only the territories of its predecessor also some new areas created by this high-speed transmission, especially in multimedia storage. Faraday has been engaged by numerous customers for product development, including one host controller provider. Faraday expects this will bring her great opportunity after the application booming in 2010.

“Just weeks after launching the leading PCIe GII solution, now Faraday has the USB 3.0PHY, which points to the fact that Faraday do have the most robust design capabilities in high-speed IO among the peers,” said Steve Wang, Chief Strategy Officer at Faraday. “As a contributor to the USB Implementers Forum (USB-IF), Faraday has been dedicated to USB 3.0 development in order to deliver early products right after the specification’s finalization. We have a clear roadmap ahead and the achievement is satisfying so far. Following the 0.13um PHY, the 90nm PHY will be available soon, and 55nm and 40nm are under development as well. Faraday is optimistic in USB 3.0′s prevalence and confident with our ability to provide the most competitive USB 3.0 solution and service,” he added.

“We are pleased to see that a USB 3.0 PHY solution has been made available from Faraday” said Jeff Ravencraft, USB-IF president and chairman. “The market is ready for SuperSpeed USB technology to meet the increasing demand for faster transfer speeds. USB 3.0 PHY solutions like Faraday’s will help enable the industry to bring SuperSpeed USB products to the market.”

To achieve the specification with trade-off between power and die size, Faraday has carried out some sophisticated improvement in this PHY architecture, including a new compensation circuits in the equalizer of receiver to eliminate the channel loss caused by the cable and trace wire in the board. Some other new architectures also work for clock data recovery and transmitter to make the eye diagram meet the specification in all conditions.

Event notice

At the upcoming SuperSpeed USB Developers Conference (5/20-5/21, Tokyo, JP), Faraday will demo the complete USB 3.0 solutions, covering host solution (USB 3.0-PCIe) on PC, device platforms for SSD development, and USB 3.0-SATA bridge chip.


The Same Size and Thickness as a Credit Card, the New 4GB and 1GB Slim Data USB Cards Flatten the USB Flash Drive Market Delivering the Most Usable, Versatile, Easy-to-Carry Form Factor for Consumers and Businesses

TopTech Products announced the nationwide availability of the Slim Data USB Card through its website, www.TopTechProducts.com.  The Slim Data USB Card, a high-quality, plug-and-play, ultra-slim USB flash drive the size of a credit card, can be conveniently carried in a wallet enabling users to keep their USB storage with them at all times, minimizing the chance of loss or misplacement.

Slim Data USB Card

The Slim Data USB Card, which is available in a variety of colors, enables users to conveniently store and carry digital photos, music, video clips, and other documents in their wallets keeping them available to share with friends or family whenever or wherever the need arises.  Weighing a mere nine grams, large amounts of digital data can be stored on a Slim Data USB Card and sent easily through the mail.

The customizable Slim Data USB Cards, which are available in both 4GB and 1GB capacities, give businesses an innovative way to distribute presentations and marketing materials on a medium that will be reused for years by the customer providing the company with valuable long-term branding.  In addition, companies can become more eco-friendly by distributing their marketing materials in electronic format and eliminating the need to print expensive marketing materials.

Available in multiple colors, Slim Data USB Cards are Mac, PC, and Linux compatible and support both USB 2.0 and 1.1 interfaces.

Product Features and Specifications:

  • Storage Capacities: 1GB and 4GB
  • Dimensions: 3.4” x 2.1” x 0.11”  (9 x 5 x .25 cm)
  • Compatibility:  Windows, Macintosh, Linux
  • Interface:  USB 2.0, USB 1.1
  • Warranty: Limited lifetime warranty
  • Colors: Clear, Gray, Orange, Red, and Blue
  • Customization:  Custom colors and printing are available.  (Minimum quantities apply.)

Slim Data USB Cards are backed by a limited-lifetime warranty from the manufacturer and are available at www.TopTechProducts.com at a list price of $24.99 for the 4GB card.


USBMobile(TM) T2 combines CATC Trace display with advanced debug features

Offers several flexible configurations starting at $799

LeCroy Corporation, a worldwide leader for serial data test solutions, announced the availability of a new low-cost USB 2.0 analyzer called the USBMobile(TM) T2. This PC card-based analyzer features the defacto standard CATC Trace(TM) hierarchical display and will be offered in three configurations starting at $799. Designed specifically to meet the needs of USB developers in the embedded system and software markets, this introduction makes lab quality analysis tools affordable for engineers at every level of USB design and test.

Starting at $799, the USBMobile PDQ provides a new paradigm in “application” level analysis. It captures device traffic and provides automatic application level decoding without the bits-and-bytes of the lower layers. The PDQ edition offers many of the same analysis and decoding displays as LeCroy’s flagship USB analyzers, yet at a fraction of the cost.

“Many of our USB customers working in application and driver development do not require visibility of token level exchanges,” said Michael Romm, Director of Product Development at LeCroy Protocol Division. “Driver developers are primarily focused on device specific commands or USB Request Block (URB) events. If lower layer analysis is required, the USBMobile PDQ is easily upgradeable.”

The USBMobile Standard edition adds lower-level packet views found in LeCroy’s full-featured USB analyzers. At $1199, the Standard edition also includes hardware-based triggering that can be essential for capturing and debugging intermittent software driver issues.

The top-of-the-line USBMobile Advanced edition is a complete analysis tool suitable for even the most experienced USB developer. Professional level capabilities including sequential triggering and comprehensive device class decoding with the CATC Trace give users a highly affordable solution without compromising on features.

“Our customers want to put more analyzers on their developer’s desks and the USBMobile T2 makes that possible,” said Roy Chestnut, Product Line Manager, Protocol Solutions Group, LeCroy Corporation. “For over 14 years, the reliability and the ease of use provided by the CATC USB analyzers gives our users the confidence that their USB products will be of the highest quality.”

Based on LeCroy’s original PCMCIA form-factor analyzer, the USBMobile T2 supports low-, full-, and high-speed USB as well as the On-the-Go (OTG) specification. All three versions of the USBMobile T2 benefit from innovative analysis features pioneered by the developers of the original CATC Trace. Bus utilization, performance metrics, error triggering and reporting all help reduce debugging time and accelerate time-to-market for USB 2.0 R&D teams.

Availability

USBMobile T2 can be ordered immediately and will begin shipping on June 1st, 2009. For additional information visit the LeCroy web site (www.lecroy.com).





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